Title :
A high performance drying method enabling clustered single wafer wet cleaning
Author :
Mertens, P.W. ; Doumen, G. ; Lauerhaas, J. ; Kenis, K. ; Fyen, W. ; Meuris, M. ; Arnauts, S. ; Devriendt, K. ; Vos, R. ; Heyns, M.
Author_Institution :
IMEC, Leuven, Belgium
Abstract :
A novel fast drying method for single wafer wet cleaning is proposed. The water-mark free drying method is based on an efficient interaction between Marangoni forces and rotational forces. The method is shown to yield excellent particle performance.
Keywords :
cluster tools; drying; surface cleaning; Marangoni force; clustered single wafer wet cleaning; drying method; particulate contamination; rotational force; Availability; Cleaning; Degradation; Manufacturing processes; Process control; Production; Testing; Time factors; Timing; US Department of Transportation;
Conference_Titel :
VLSI Technology, 2000. Digest of Technical Papers. 2000 Symposium on
Conference_Location :
Honolulu, HI, USA
Print_ISBN :
0-7803-6305-1
DOI :
10.1109/VLSIT.2000.852768
