• DocumentCode
    2162038
  • Title

    Characterization of interface traps in SOI material

  • Author

    Vanheusden, K. ; Warren, W.L. ; Shedd, W.M. ; Pugh, R.D. ; Fleetwood, D.M. ; Schwank, J.R. ; Devine, R.A.B.

  • Author_Institution
    Phillips Lab., Kirtland AFB, NM, USA
  • fYear
    1997
  • fDate
    6-9 Oct 1997
  • Firstpage
    64
  • Lastpage
    65
  • Abstract
    In SOI material, the presence of interface traps at the buried oxide layer interfaces has been demonstrated from electrical data. More recently, interface defects were identified at the buried oxide interfaces in SOI material. In this study we use heat treatment under high-vacuum (instead of an inert ambient such as Ar) as a tool to enhance the buried interface trap density in the SOI material. The results provide new insights into the microscopic, chemical, and electrical signature of these interface traps in SOI
  • Keywords
    annealing; electron traps; interface states; point defects; silicon-on-insulator; SOI material; buried oxide layer interfaces; electrical signature; heat treatment; interface traps; trap density; Annealing; Electron traps; Hydrogen; Laboratories; Paramagnetic materials; Paramagnetic resonance; Space missions; Temperature; Threshold voltage; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1997. Proceedings., 1997 IEEE International
  • Conference_Location
    Fish Camp, CA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-3938-X
  • Type

    conf

  • DOI
    10.1109/SOI.1997.634934
  • Filename
    634934