Title :
Transmission Lines on Low Resistivity Silicon Substrate for MMICs Applications
Author :
Six, G. ; Vanmackelberg, M. ; Happy, H. ; Dambrine, G. ; Boret, S. ; Gloria, D.
Author_Institution :
Institut d´´Electronique et de Microélectronique du Nord, UMR CNRS 9929, Université des Sciences et Technologies de Lille, Avenue Poincarré, BP 69, 59652 Villeneuve d´´Ascq - France. Gonzague.six@iemn.univ-lille1.fr
Abstract :
In this paper, transmission lines structures (Thin Film Microstrip -TFMS- and coplanar waveguide -CPW-) on low resistivity (¿ = 10 ¿-cm) silicon substrate are investigated, for millimeter wave applications. From the designer point of view, useful parameters such as losses versus characteristic impedance are calculated. The results obtained on TFMS fabricated with CMOS 15 ¿-cm process from ST Microelectronics (five metal levels) and an alternative solution using BCB layer are shown. Moreover, low loss CPW structures on silicon substrate are designed and optimized using a thick dielectric layer (10 ¿m of BCB). Finally, to obtain low value of characteristic impedance with this configuration, a fully embedded CPW transmission line is used. Attenuation coefficient of these structures is less than 0.6 dB/mm @ 50GHz.
Keywords :
Conductivity; Coplanar transmission lines; Coplanar waveguides; Dielectric losses; Dielectric substrates; Impedance; MMICs; Semiconductor thin films; Silicon; Transmission lines;
Conference_Titel :
Microwave Conference, 2001. 31st European
Conference_Location :
London, England
DOI :
10.1109/EUMA.2001.338998
