Optimal design of self-damped lossy transmission lines for multichip modules

Author

Wang, Jimmy Shinn-Hwa ; Dai, Wayne Wei-Ming

Author_Institution

Comput. Eng. Board of Studies, California Univ., Santa Cruz, CA, USA

fYear

1994

fDate

10-12 Oct 1994

Firstpage

594

Lastpage

598

Abstract

This paper presents a simple and robust method of designing the lossy-transmission-line interconnects for multichip modules (MCM). This method uses wire-sizing to meet the electrical damping criteria to propagate high-speed signals through unterminated lossy transmission lines on the substrates of multichip modules. Based on an improved scattering-parameters (S-parameters) macro-model of transmission lines, wire-sizing optimal design method relates the layout parameter (line width) and the transfer function (damping ratio, and natural undamped frequency) to the signal propagation delay. The optimal design method results in fast and stable signal propagation for single-source multi-receiver networks on multichip modules without using termination resistors

Keywords

circuit analysis computing; multichip modules; substrates; transmission lines; S-parameters macro-model; electrical damping criteria; layout parameter; lossy-transmission-line interconnects; multichip modules; optimal design; self-damped lossy transmission lines; signal propagation delay; single-source multi-receiver networks; substrates; termination resistors; transfer function; wire-sizing; Damping; Design methodology; Frequency; Multichip modules; Propagation delay; Propagation losses; Robustness; Scattering parameters; Transfer functions; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Computer Design: VLSI in Computers and Processors, 1994. ICCD '94. Proceedings., IEEE International Conference on

Conference_Location

Cambridge, MA

Print_ISBN

0-8186-6565-3

Type

conf

DOI

10.1109/ICCD.1994.331984

Filename

331984