Analysis of Cavity-Backed Multilayer Microstrip Patch Arrays on Continuous Dielectric Substrates by a Hybrid Modular Technique

This work proposes a numerical procedure to analyse a novel cavity-backed microstrip array configuration that combines both the conventional disposition of patches on continuous dielectric layers and patches enclosed in metallic cavities. Different numerical techniques are effectively combined to obtain a modular approach appropriate for designing complex multilayer structures. Additionally, and based on the application of this modular technique, results for an alternative broad-band cavity-backed and capacitively probe-fed microstrip array configuration will be presented.