Title :
Interface between inorganic fillers and polymers
Author :
Xianyou, Zhang ; Xiaohong, Zhang ; Yong, Shi
Author_Institution :
Harbin Inst. of Electr. Technol., China
Abstract :
The interface problems between inorganic fillers and polymers were studied in the paper. The effects of the surface treatment of inorganic fillers, size and shape of particles and filler content on properties of polymers were discussed. It was found that the interfacial bonding between filler and matrix polymer was improved and the content of inorganic fillers in polymers was increased by means of the surface treatment of inorganic fillers. When different fillers were blended into the polymer at the same time, co-operative effects on mechanical and dielectrical properties of the polymer could be observed. The polymers involved in the paper are epoxy resin perfusing sizing; cable compound and antistatical PVC etc
Keywords :
Active matrix organic light emitting diodes; Bonding; Epoxy resins; Mechanical factors; Polymers; Power transformer insulation; Shape; Surface cracks; Surface treatment; Viscosity;
Conference_Titel :
Properties and Applications of Dielectric Materials, 1994., Proceedings of the 4th International Conference on
Conference_Location :
Brisbane, Qld.
Print_ISBN :
0-7803-1307-0
DOI :
10.1109/ICPADM.1994.414009
