Abstract :
The following topics are dealt with: process integration; interconnect systems; novel materials and concepts; TSV/3D processes and integration; metrology and process control; reliability; materials and unit processes; and packaging.
Keywords :
integrated circuit interconnections; measurement; packaging; process control; reliability; TSV-3D processes; interconnect systems; metrology; novel materials; packaging; process control; process integration; reliability; unit processes;
Conference_Titel :
Interconnect Technology Conference, 2009. IITC 2009. IEEE International
Conference_Location :
Sapporo, Hokkaido
Print_ISBN :
978-1-4244-4492-2
DOI :
10.1109/IITC.2009.5090322
