A Double thick-polymer technology to realize low signal pad capacitance suitable for high-speed data transmission

Author

Kikuchi, Katsumi ; Sakai, Jun ; Soejima, Koji ; Funato, Shinya ; Kawano, Masaya ; Kouta, Hikaru ; Yamamichi, Shintaro

Author_Institution

NEC Corp., Sagamihara

fYear

2009

fDate

1-3 June 2009

Firstpage

89

Lastpage

91

Abstract

A Pad-on-Stacked-Polymer (PASPO) technology, based on low cost packaging process, has been developed by utilizing 13-mum-thick double polymer layers and modified signal land design. The bottom photosensitive polymer shows higher via-hole resolution and higher chemical tolerance than conventional passivation polymer. The highly-reliable top polymer is planarized by CMP. For the 20-mum-square signal land, the PASPO technology drastically reduces the signal pad capacitance from 173 fF to 11 fF, and a clear eye opening for 40 Gbps signal transmission has been achieved for the low-k test chip.

Keywords

capacitance; chemical mechanical polishing; optical fibre communication; optical polymers; packaging; planarisation; CMP; PASPO technology; bit rate 40 Gbit/s; capacitance 11 fF; capacitance 173 fF; double thick-polymer technology; packaging; pad-on-stacked-polymer; photosensitive polymer; planarisation; signal pad capacitance; Capacitance; Chemical technology; Costs; Data communication; Packaging; Passivation; Polymers; Signal design; Signal processing; Signal resolution;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 2009. IITC 2009. IEEE International

Conference_Location

Sapporo, Hokkaido

Print_ISBN

978-1-4244-4492-2

Electronic_ISBN

978-1-4244-4493-9

Type

conf

DOI

10.1109/IITC.2009.5090348

Filename

5090348