Electrode and substrate contacts in carbon nanofiber interconnects

Author

Saito, Tsutomu ; Yabutani, Hisashi ; Yamada, Toshishige ; Wilhite, Patrick ; Yang, Cary Y.

Author_Institution

Center for Nanostruct., Santa Clara Univ., Santa Clara, CA

fYear

2009

fDate

1-3 June 2009

Firstpage

125

Lastpage

127

Abstract

To study the reliability of carbon nanofiber (CNF) interconnect under high-current stress, electrical and thermal transports across CNF-electrode interfaces and between electrodes are considered. For this investigation, three different types of contacts are examined: (a) CNF-Au electrode, (b) CNF-SiO₂ substrate, and (c) tungsten-deposited CNF-Au electrode. We have determined that contact (c) improves the overall electrical and thermal transport characteristics of the system.

Keywords

carbon fibres; electric breakdown; electrical contacts; electrodes; gold; integrated circuit interconnections; metal-insulator boundaries; nanofibres; reliability; silicon compounds; substrates; thermal conductivity; tungsten; C-Au; C-SiO₂; C-W-Au; breakdown location; carbon nanofiber interconnects; current capacity; electrical transport; electrode contacts; reliability; substrate contacts; thermal transport; Carbon nanotubes; Contact resistance; Electric breakdown; Electrodes; Electrothermal effects; Gold; Image segmentation; Nanostructures; Testing; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Interconnect Technology Conference, 2009. IITC 2009. IEEE International

Conference_Location

Sapporo, Hokkaido

Print_ISBN

978-1-4244-4492-2

Electronic_ISBN

978-1-4244-4493-9

Type

conf

DOI

10.1109/IITC.2009.5090360

Filename

5090360