Title :
Electrode and substrate contacts in carbon nanofiber interconnects
Author :
Saito, Tsutomu ; Yabutani, Hisashi ; Yamada, Toshishige ; Wilhite, Patrick ; Yang, Cary Y.
Author_Institution :
Center for Nanostruct., Santa Clara Univ., Santa Clara, CA
Abstract :
To study the reliability of carbon nanofiber (CNF) interconnect under high-current stress, electrical and thermal transports across CNF-electrode interfaces and between electrodes are considered. For this investigation, three different types of contacts are examined: (a) CNF-Au electrode, (b) CNF-SiO2 substrate, and (c) tungsten-deposited CNF-Au electrode. We have determined that contact (c) improves the overall electrical and thermal transport characteristics of the system.
Keywords :
carbon fibres; electric breakdown; electrical contacts; electrodes; gold; integrated circuit interconnections; metal-insulator boundaries; nanofibres; reliability; silicon compounds; substrates; thermal conductivity; tungsten; C-Au; C-SiO2; C-W-Au; breakdown location; carbon nanofiber interconnects; current capacity; electrical transport; electrode contacts; reliability; substrate contacts; thermal transport; Carbon nanotubes; Contact resistance; Electric breakdown; Electrodes; Electrothermal effects; Gold; Image segmentation; Nanostructures; Testing; Thermal stresses;
Conference_Titel :
Interconnect Technology Conference, 2009. IITC 2009. IEEE International
Conference_Location :
Sapporo, Hokkaido
Print_ISBN :
978-1-4244-4492-2
Electronic_ISBN :
978-1-4244-4493-9
DOI :
10.1109/IITC.2009.5090360
