Investigation of image formation properties of 3-D dielectric DNG and wire mesh ENZ metamaterials at microwave frequencies

Author

Pulito, Daniel A. ; Venkataraman, Jayanti ; Lu, Zhaolin

Author_Institution

Dept. of Electr. & Microelectron. Eng., Rochester Inst. of Technol. (RIT), Rochester, NY, USA

fYear

2012

fDate

8-14 July 2012

Firstpage

1

Lastpage

2

Abstract

The objective of the present work is to analyze and demonstrate the image formation properties of two novel types of 3-D metamaterials created by the Nanoplasmoncis and Metamaterials Research group at RIT that can be very easily fabricated. One is a Double Negative (DNG) material created by a triangular lattice of holes drilled in a high dielectric permittivity material to obtain a refractive index of -1 at 30.7GHz. The other is an Epsilon Near Zero (ENZ) metamaterial consisting of thin wire grids on Styrofoam fabricated using electronic textile technology for which the plasma frequency is 17.287 GHZ where, ε becomes zero. A comprehensive study of both structures has been done in the 3D software CST MICROWAVE STUDIO™. Measurements have been performed on the ENZ structure using an electric field probing system to validate a constant phase and field strength in the transmission plane at plasma frequency.

Keywords

dielectric materials; metamaterials; microwave imaging; permittivity; refractive index; 3D dielectric DNG; 3D software CST microwave studio; RIT; double negative material; electric field; electronic textile technology; epsilon near zero metamaterial; fabricated styrofoam; frequency 17.287 GHz; frequency 30.7 GHz; high dielectric permittivity material; image formation properties; microwave frequencies; nanoplasmoncis; plasma frequency; refractive index; thin wire grids; transmission plane; triangular lattice; wire mesh ENZ metamaterials; Dielectrics; Lenses; Magnetic materials; Metamaterials; Plasmas; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium (APSURSI), 2012 IEEE

Conference_Location

Chicago, IL

ISSN

1522-3965

Print_ISBN

978-1-4673-0461-0

Type

conf

DOI

10.1109/APS.2012.6349424

Filename

6349424