Title :
Weibull slopes, critical defect density, and the validity of stress-induced-leakage current (SILC) measurements
Author :
Wu, E.Y. ; Sune, J. ; Nowak, E. ; Lai, W. ; McKenna, J.
Author_Institution :
Microelectron. Div., IBM Co., Essex Junction, VT, USA
Abstract :
Voltage, temperature, and polarity dependence of Weibull slopes are carefully measured using area scaling method over a wide range of voltages and temperatures for several oxide thickness (T/sub OX/) values in comparison with direct method. We investigate the validity of stress-induced-leakage-current (SILC), /spl Delta/J/J/sub 0|BD/, as a measure for the critical defect density, N/sub BD/. Our finding clearly shows that the /spl Delta/J/J/sub 0|BD/ cannot be used as a reliable measure of N/sub BD/. This work suggests that a re-evaluation of the breakdown models constructed from the SILC-based measurements is required in gate oxide reliability community, in particular, their validity in comparison with the statistically accurate breakdown data.
Keywords :
Weibull distribution; electric current measurement; leakage currents; semiconductor device breakdown; semiconductor device measurement; semiconductor device reliability; Weibull slope; area scaling method; breakdown model; critical defect density; direct method; gate oxide reliability; oxide thickness; polarity dependence; stress-induced-leakage current measurement; temperature dependence; voltage dependence; Area measurement; Breakdown voltage; Current measurement; Density measurement; Electric breakdown; Microelectronics; Stress measurement; Temperature dependence; Temperature distribution; Thickness measurement;
Conference_Titel :
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7050-3
DOI :
10.1109/IEDM.2001.979448