Cobalt and nickel atomic layer depositions for contact applications

Novel NH₃-based Co thermal atomic layer deposition (T-ALD) process using Co(iPr-AMD)₂ (bis(N,N´-diisopropylacetamidinato) cobalt(II)) and NH₃ as a precursor and a reactant, respectively, was developed for nanoscale contact applications. The T-ALD Co films showed high purity with perfect conformality inside nanosize contact holes. By annealing the T-ALD Co films, CoSi₂ was obtained. Similarly, Ni T-ALD process using NH₃ as a reactant was also investigated by using Ni(dmamb)₂ (bis(dimethylamino-2-methyl-2-butoxo)nickel) and Ni films showed perfect conformality of T-ALD Ni.