Title :
A novel high coplanarity lead free copper pillar bump fabrication process
Author :
Hsu, Hou-Jun ; Huang, Jung-Tang ; Lee, Kuo-Yu ; Wu, Rung-Gen ; Tsai, Ting-Chiang
Author_Institution :
Inst. of Mech. & Electr. Eng., Nat. Taipei Univ. of Technol., Taipei
Abstract :
In this paper, we report a novel plating-friendly polishing mechanism for fabrication of high coplanarity and high density lead-free copper pillar bumps for advanced packaging applications. The final experimental results showed that the UIW (Uniformity in Wafer) could be sharply decreased from 6.37% after plating to 1.7% after polishing and even to 1.7% after reflow throughout the entire 4 inch wafer.
Keywords :
polishing; wafer level packaging; copper pillar bump fabrication process; lead free copper pillar; packaging applications; polishing mechanism; uniformity in wafer; Circuits; Copper; Environmentally friendly manufacturing techniques; Equations; Fabrication; Flowcharts; Lithography; Packaging; Semiconductor device measurement; Tin; Copper Pillar; High Coplanarity; Lead-Free;
Conference_Titel :
Interconnect Technology Conference, 2009. IITC 2009. IEEE International
Conference_Location :
Sapporo, Hokkaido
Print_ISBN :
978-1-4244-4492-2
Electronic_ISBN :
978-1-4244-4493-9
DOI :
10.1109/IITC.2009.5090377
