Title :
Heterogeneous integration: from substrate technology to active packaging
Author :
Brown, A.S. ; Jokerst, N.M. ; Doolittle, A. ; Brooke, M. ; Kuech, T.F. ; Sang-Woo Seo ; Sangbeom Kang ; Sa Huang ; Jeng-Jung Shen
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Heterogeneous integration of dissimilar materials and devices is necessary for the continued advancement of electronic and optoelectronic systems. A range of processes has been developed in recent years that will enable system integration and advanced packaging. Herein, we outline our approaches towards heterogeneous integration.
Keywords :
packaging; substrates; active packaging; electronic system; heterogeneous integration; optoelectronic system; substrate technology; Chemical technology; Detectors; Electronics packaging; Gallium nitride; Heterojunctions; Lithium; Molecular beam epitaxial growth; Semiconductor materials; Substrates; Wafer bonding;
Conference_Titel :
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7050-3
DOI :
10.1109/IEDM.2001.979465
