Title :
Impact of LER on BEOL dielectric reliability: A quantitative model and experimental validation
Author :
Tökei, Zs ; Roussel, Ph ; Stucchi, M. ; Versluijs, J. ; Ciofi, I. ; Carbonell, L. ; Beyer, G.P. ; Cockburn, A. ; Agustin, M. ; Shah, K.
Author_Institution :
IMEC, Leuven
Abstract :
For the first time we provide a model for describing the LER induced BEOL TDDB lifetime reduction. The model was validated on 50 nm frac12 pitch copper damascene lines embedded into a k=2.5 low-k material.
Keywords :
dielectric materials; electric breakdown; electron beam lithography; integrated circuit interconnections; integrated circuit reliability; BEOL dielectric reliability; LER; TDDB lifetime reduction; pitch copper damascene lines; Copper; Dielectric breakdown; Dielectric materials; Dielectric measurements; Electronic mail; Lithography; Testing; Time measurement; Tin; Voltage;
Conference_Titel :
Interconnect Technology Conference, 2009. IITC 2009. IEEE International
Conference_Location :
Sapporo, Hokkaido
Print_ISBN :
978-1-4244-4492-2
Electronic_ISBN :
978-1-4244-4493-9
DOI :
10.1109/IITC.2009.5090395
