DocumentCode :
2165344
Title :
High performance 50 nm CMOS devices for microprocessor and embedded processor core applications
Author :
Shih-Fen Huang ; Chih-Yung Lin ; Yu-Shyang Huang ; Schafbauer, T. ; Eller, M. ; Yao-Ching Cheng ; Shui-Ming Cheng ; Sportouch, S. ; Wei Jin ; Rovedo, N. ; Grassmann, A. ; Yimin Huang ; Brighten, J. ; Liu, C.H. ; von Ehrenwall, B. ; Chen, N. ; Jia Chen ; P
fYear :
2001
fDate :
2-5 Dec. 2001
Abstract :
50 nm CMOS transistors for high performance and low active power applications are presented. Good short-channel effect control is achieved down to 35 nm gate length. These transistors will be incorporated in a leading edge 100 nm technology, with optimized triple well, nitrided oxide gate dielectrics, 193-nm lithography, 9-level hierarchical Cu interconnects, and low-k dielectrics. These high performance transistors have the best current drive at a given leakage current reported in the literature.
Keywords :
CMOS digital integrated circuits; embedded systems; integrated circuit technology; leakage currents; low-power electronics; microprocessor chips; 193 nm; 50 nm; CMOS transistor; DUV lithography; current drive; device technology; embedded processor core; leakage current; low active power; low-k dielectric; microprocessor core; multi-level hierarchical Cu interconnect; nitrided oxide gate dielectric; optimized triple well; short-channel effect control; CMOS process; CMOS technology; Dielectrics; Isolation technology; Leakage current; Lithography; MOSFETs; Microelectronics; Microprocessors; Space technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7050-3
Type :
conf
DOI :
10.1109/IEDM.2001.979474
Filename :
979474
Link To Document :
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