2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

The following topics were dealt with: automated assembly; optoelectronic modules; flip-chip processing; wafer-level packaging; solder technology; passive components; optical alignment techniques; electrical and thermal modeling; underfill materials; chip-scale packaging; reliability testing; RF components; optoelectronic packaging; high density chip and PWB technologies; material characterization and modeling; MEMS packaging and bonding technology; power distribution and EMI modeling; low cost good die; plating and under bump materials; adhesives; MCM technology; electronics packaging education; lead-free interconnects, solders and conductive adhesives; connectors and contacts; BGA packaging; parallel optical interconnects