DocumentCode
2165716
Title
A new approach to implement a defect tolerant power distribution network in WSI circuits
Author
Yung, Michael W. ; Little, Michael J.
Author_Institution
Hughes Res. Lab., Malibu, CA, USA
fYear
1991
fDate
29-31 Jan 1991
Firstpage
215
Lastpage
222
Abstract
An efficient approach for implementing a defect-tolerant power distribution network suitable for WSI (wafer scale integration) circuits is proposed. The network is not segmented but relies on a thermal imaging technique for defect localization and laser cutting for defect isolation. Power bus designs for this approach are described. Preliminary, experimental results have verified the design concepts
Keywords
VLSI; fault location; infrared imaging; laser beam machining; temperature measurement; WSI circuits; defect isolation; defect localization; defect tolerant power distribution network; design concepts; experimental results; laser cutting; power bus designs; temperature mapping; thermal imaging technique; thermography; wafer scale integration; Circuit testing; Image segmentation; Infrared imaging; Intelligent networks; Joining processes; Liquid crystals; Optical imaging; Power lasers; Power supplies; Power systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Wafer Scale Integration, 1991. Proceedings., [3rd] International Conference on
Conference_Location
San Francisco, CA
Print_ISBN
0-8186-9126-3
Type
conf
DOI
10.1109/ICWSI.1991.151718
Filename
151718
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