DocumentCode :
2165834
Title :
Low-Loss Microstrip MEMS Technology for RF Passive Components
Author :
Martoglio, L. ; Richalot, E. ; Picon, O. ; Lissorgues-Bazin, G. ; Vasseure, C.
Author_Institution :
Université Marne-la-Vallée, Bâtiment Lavoisier, rue Galilée, 77420 Champs-sur-Marne - France, 01.60.95.72.79, lmartogl@univ-mlv.fr
fYear :
2001
fDate :
24-26 Sept. 2001
Firstpage :
1
Lastpage :
4
Abstract :
A new low loss and low cost microstrip MEMS technology is presented. Two inverted microstrip lines, one on low loss silicon and the other on glass have been measured and simulated. A good concordance of the results has been obtained. Simulations have been used to study the influence of several parameters, and the results of simulations allow us to adjust the lines dimensions to prescribed characteristics.
Keywords :
CMOS technology; Conductivity; Costs; Glass; Impedance; Micromechanical devices; Microstrip components; Radio frequency; Silicon; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2001. 31st European
Conference_Location :
London, England
Type :
conf
DOI :
10.1109/EUMA.2001.339124
Filename :
4140192
Link To Document :
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