DocumentCode :
2166165
Title :
The high frequency and power performance of SiGe HBTs with SIC structure at cryogenic temperature
Author :
Hsieh, M.W. ; Liang, K.H. ; Chan, Y.-J. ; Lee, C.Y. ; Chen, G.J. ; Tang, Denny D L
Author_Institution :
Dept. of Electr. Eng., Nat. Central Univ., Jhongli, Taiwan
fYear :
2005
fDate :
12-17 June 2005
Abstract :
The high-frequency behavior and power capability of SiGe HBTs with selectively implanted collector structure have been measured at temperature between 77 and 350 K. Detailed analyses of temperature dependence on dc, high-frequency parameters, and power performances are presented. An HBT transit-time analysis is also described to find out the factors causing the increase in cutoff frequency (fT) at low temperature operation of different functionality of devices. In addition, the power capability of enhanced-breakdown device at liquid-nitrogen temperature is severely degraded.
Keywords :
Ge-Si alloys; cryogenic electronics; heterojunction bipolar transistors; millimetre wave bipolar transistors; semiconductor device breakdown; semiconductor materials; 77 to 350 K; HBT high frequency behavior; HBT power performance; HBT transit-time analysis; SiGe; cryogenic temperature; cutoff frequency increase; enhanced-breakdown device; heterojunction bipolar transistors; high-frequency parameters; liquid-nitrogen temperature; low temperature operation; selectively implanted collector structure; temperature dependence; Cryogenics; Frequency; Germanium silicon alloys; Performance analysis; Performance evaluation; Power measurement; Silicon carbide; Silicon germanium; Temperature dependence; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2005 IEEE MTT-S International
ISSN :
01490-645X
Print_ISBN :
0-7803-8845-3
Type :
conf
DOI :
10.1109/MWSYM.2005.1517199
Filename :
1517199
Link To Document :
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