• DocumentCode
    2166226
  • Title

    Layout, design finish and packaging of a redundant signal multiprocessor architecture with WSI dimensions

  • Author

    Link, Theo ; Teich, Wolfgang ; Werner, Axel

  • Author_Institution
    Philips Components, Hamburg, Germany
  • fYear
    1991
  • fDate
    29-31 Jan 1991
  • Firstpage
    236
  • Lastpage
    242
  • Abstract
    An ASIC (application specific integrated circuit) design flow for the realization of a multiprocessor structure has been successfully established and verified. This design flow includes standard tools and project-specific extensions, especially for verification tasks and preparation of WSI (wafer scale integration) data fractioning. The achieved layout and factory finishing method `nonoverlapping hierarchy´ uses the regular multiproject wafer approach of an ASIC direct-write E-beam foundry and seems to have no area limits within the available wafer dimensions. Due to the extensive utilization of standard tools and flows wherever possible, a fast design and fabrication process for prototypes is guaranteed. This leads to a minimization of manpower, time, and processing costs
  • Keywords
    VLSI; application specific integrated circuits; circuit layout CAD; digital signal processing chips; multiprocessing systems; packaging; ASIC design flow; ASIC direct-write E-beam foundry; WSI data fractioning; WSI dimensions; application specific integrated circuit; design finish; fast design and fabrication process; minimization of manpower; multiprocessor structure; packaging; project-specific extensions; prototypes; redundant signal multiprocessor architecture; regular multiproject wafer approach; verification tasks; wafer scale integration; Application specific integrated circuits; Fabrication; Finishing; Foundries; Integrated circuit packaging; Process design; Production facilities; Prototypes; Signal design; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1991. Proceedings., [3rd] International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-8186-9126-3
  • Type

    conf

  • DOI
    10.1109/ICWSI.1991.151720
  • Filename
    151720