DocumentCode :
2166408
Title :
Local mechanical-stress control (LMC): a new technique for CMOS-performance enhancement
Author :
Shimizu, A. ; Hachimine, K. ; Ohki, N. ; Ohta, H. ; Koguchi, M. ; Nonaka, Y. ; Sato, H. ; Ootsuka, F.
Author_Institution :
Hitachi ULSI Syst. Co. Ltd, Tokyo, Japan
fYear :
2001
fDate :
2-5 Dec. 2001
Abstract :
We have developed a new technique, called "local mechanical-stress control" (LMC), to enhance CMOS current drivability. It utilizes high mechanical stress produced by a SiN layer and Ge-ion implantation to selectively relax the stress of the layer. The drive currents of both n- and p-MOSFETs can be improved by controlling the stress of the SiN layer selectively. The effects of LMC become more significant as devices become smaller, and the drive current is estimated to increase by more than 20% in future 70-nm CMOS technology.
Keywords :
CMOS integrated circuits; MOSFET; internal stresses; ion implantation; stress control; stress relaxation; 70 nm; 70-nm CMOS technology; CMOS current drivability enhancement; Ge-ion implantation; Si:Ge; SiN; SiN layer; drive current; heavy mechanical stress; local mechanical-stress control; n-MOSFETs; p-MOSFETs; selective stress relaxation; CMOS technology; Compressive stress; High temperature superconductors; MOSFETs; Process control; Silicon compounds; Strain measurement; Stress control; Tensile stress; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7050-3
Type :
conf
DOI :
10.1109/IEDM.2001.979529
Filename :
979529
Link To Document :
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