Title :
Advanced packaging technologies in MOSFETs for power management
Author :
Tsui, Anthony ; Sarkis, Jingo ; Chen, Howard
Author_Institution :
Vishay Siliconix, Santa Clara, CA, USA
Abstract :
The existing consumer electronic market demands an overall system miniaturization, and in particular miniaturization of power conversion circuits and their associated power MOSFETs. This has created a need for smaller devices with higher power performance, yet without sacrificing power performance. Advanced silicon technologies combined with surface mount power packages are designed to serve the ever-increasing demands placed on power designers
Keywords :
power MOSFET; semiconductor device packaging; surface mount technology; consumer electronics; miniaturization; power MOSFET; silicon technology; surface mount package; Circuits; Consumer electronics; Electronics packaging; Energy management; MOSFETs; Power conversion; Power system management; Silicon; Surface-mount technology; Technology management;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853138
