DocumentCode :
2166683
Title :
Properties of Ru-Ta alloys as gate electrodes for NMOS and PMOS silicon devices
Author :
Huicai Zhong ; Shin-Nam Hong ; You-Seok Suh ; Lazar, H. ; Heuss, G. ; Misra, V.
Author_Institution :
Dept. of Electr. Eng., North Carolina State Univ., Raleigh, NC, USA
fYear :
2001
fDate :
2-5 Dec. 2001
Abstract :
This paper describes the characteristics of binary metallic alloys of Ta and Ru for gate electrode applications. The work function of this alloy can be varied from 4.2 eV to 5.2 eV by controlling the composition thereby enabling its use in both NMOS and PMOS devices. Excellent thermal stability up to 1000/spl deg/C was observed in alloy compositions suitable for both NMOS and PMOS devices. It is believed that the Ru/sub 1/Ta/sub 1/ phase of the film and formation of Ru-Ta bonds improves the thermal stability of the gate-dielectric interface while maintaining appropriate work functions.
Keywords :
CMOS integrated circuits; MOSFET; integrated circuit metallisation; metal-insulator boundaries; ruthenium alloys; semiconductor device metallisation; silicon; tantalum alloys; thermal stability; work function; 4.2 to 5.2 eV; Ru-Ta alloys; Ru-Ta bonds; RuTa; Si; Si NMOS devices; Si PMOS devices; alloy compositions; binary metallic alloys; gate electrode applications; gate-dielectric interface; thermal stability; work function; Capacitance-voltage characteristics; Dielectrics; Electrodes; MOS devices; Rapid thermal annealing; Silicon alloys; Silicon devices; Sputtering; Temperature; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7050-3
Type :
conf
DOI :
10.1109/IEDM.2001.979543
Filename :
979543
Link To Document :
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