• DocumentCode
    2166817
  • Title

    A New Radiation Hardened by Design Latch for Ultra-Deep-Sub-Micron Technologies

  • Author

    Huang, Zhengfeng ; Liang, Huaguo

  • Author_Institution
    Sch. of Comput. & Inf., Hefei Univ. of Technol., Hefei
  • fYear
    2008
  • fDate
    7-9 July 2008
  • Firstpage
    175
  • Lastpage
    176
  • Abstract
    Soft errors induced by cosmic radiation have become an urgent issue for ultra-deep-sub-micron (UDSM) technologies. In this paper, we propose a new radiation hardened by design latch (RHBDL). RHBDL can improve robustness by masking the soft errors induced by SEU and SET. We evaluate the propagation delay, power dissipation and power delay product of RHBDL using SPICE simulations. Compared with existing reported solutions such as TMR-latch, RHBDL is less SEU-sensitive, more area efficient, delay and power efficient.
  • Keywords
    SPICE; flip-flops; radiation hardening (electronics); SPICE simulations; power delay product; power dissipation; propagation delay; radiation hardened by design latch; single event upset; soft error rate; ultradeep-submicron technologies; CMOS technology; Flip-flops; Latches; Predictive models; Propagation delay; Radiation hardening; Robustness; SPICE; Single event upset; Space technology; RHBD; dual interlock; internal feedback; soft error;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    On-Line Testing Symposium, 2008. IOLTS '08. 14th IEEE International
  • Conference_Location
    Rhodes
  • Print_ISBN
    978-0-7695-3264-6
  • Type

    conf

  • DOI
    10.1109/IOLTS.2008.9
  • Filename
    4567085