• DocumentCode
    2167071
  • Title

    A 227.5GHz InP HBT SSPA MMIC with 101mW Pout at 14.0dB Compressed Gain and 4.04% PAE

  • Author

    Griffith, Zach ; Urteaga, M. ; Rowell, Petra ; Pierson, Richard

  • Author_Institution
    Teledyne Sci. Co., Thousand Oaks, CA, USA
  • fYear
    2013
  • fDate
    13-16 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A 214-230GHz solid-state power amplifier (SSPA) MMIC is presented, where at 227.5GHz it simultaneously demonstrates 101mW P,out at 14.0dB compressed gain (4.0mW P,in), with 4.04% PAE - these record SSPA MMIC values represent increases to state-of-the-art by 12% for P,out and 2.3× for PAE at these frequencies in an HBT technology. The maximum compressed Pout is 103mW at 13.1dB gain (5.0mW P,in) and 4.08% PAE. This 2-stage amplifier has 19-21dB S21 gain from 214-235GHz, with 3-dB S21 bandwidth of 240GHz. P,DC is 2.40W. Amplifier cells were fabricated from a 250nm InP HBT technology, jointly with a substrate-shielded, thin-film microstrip wiring environment using BCB. The 80-103mW P,out (214-230GHz) is achieved by 8-way (4-way × 2-way) combining eight cascode cells. Due to the gain of the cascode cell being 10-11dB, a four cascode cell combined predriver could be used to drive the amplifier output stage into saturation - this reduces to SSPA PDC and improves PAE. Across the SSPA bandwidth, the 2:1 and 4:1 power dividers/combiners exhibit only 0.4dB and 0.5dB loss respectively.
  • Keywords
    III-V semiconductors; MMIC amplifiers; indium compounds; low-power electronics; power amplifiers; power combiners; power dividers; thin film devices; 2-stage amplifier; BCB; HBT SSPA MMIC; InP; PAE; SSPA PDC; amplifier output stage; bandwidth 240 GHz; cascode cell combined predriver; compressed gain; frequency 214 GHz to 235 GHz; gain 10 dB to 11 dB; gain 13.1 dB; gain 14 dB; gain 19 dB to 21 dB; loss 0.4 dB; loss 0.5 dB; power 101 mW; power 2.4 W; power 5 mW; power 80 mW to 103 mW; power combiners; power dividers; size 250 nm; solid-state power amplifier; substrate-shielded wiring environment; thin-film microstrip wiring environment; Frequency measurement; Gain; Heterojunction bipolar transistors; Indium phosphide; Loss measurement; MMICs; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuit Symposium (CSICS), 2013 IEEE
  • Conference_Location
    Monterey, CA
  • Type

    conf

  • DOI
    10.1109/CSICS.2013.6659190
  • Filename
    6659190