• DocumentCode
    2167119
  • Title

    Comparison of active and passive fiber alignment techniques for multimode laser pigtailing

  • Author

    Karioja, Pentti ; Ollila, Jyrki ; Putila, Veli-Pekka ; Keranen, Kimmo ; Hakkila, Jonna ; Kopola, Harri

  • Author_Institution
    VTT Electron. & Infotech., Oulu, Finland
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    244
  • Lastpage
    249
  • Abstract
    When packaging multimode lasers into low-cost modules, passive fiber alignment would be extremely advantageous especially if the fiber alignment structures could be manufactured using the injection-molding technique. Injection molding as large-volume manufacturing technique allows for the reduction of the unit price of molded parts provided that the number of parts molded by using a single molding tool is large. In this paper, we compare active and passive fiber alignment techniques. The construction and packaging procedures of two modules packaged using active and passive alignment techniques are shown. Using a sleeve construction, a multimode laser with a 230 μm×2 μm emitting area was actively pigtailed with a 100/140-μm multimode fiber. In the other example, a multimode laser with a 300 μm×~1 μm emitting area was passively pigtailed with a 200/230-μm multimode fiber by the use of an alignment structure, which was precision-machined using LIGA technique. The study shows the applicability of the passive alignment technique for low-cost fiber pigtailing
  • Keywords
    LIGA; integrated optics; modules; moulding; optical fibre couplers; semiconductor device packaging; semiconductor laser arrays; LIGA technique; active fiber alignment techniques; coupling efficiency; injection molding; laser array; laser packaging; low-cost fiber pigtailing; low-cost modules; multimode fiber; multimode laser pigtailing; passive fiber alignment techniques; precision-machining; sleeve construction; Costs; Fiber lasers; Injection molding; Integrated optics; Manufacturing; Optical devices; Optical fiber devices; Optical materials; Packaging machines; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-5908-9
  • Type

    conf

  • DOI
    10.1109/ECTC.2000.853157
  • Filename
    853157