DocumentCode
2167119
Title
Comparison of active and passive fiber alignment techniques for multimode laser pigtailing
Author
Karioja, Pentti ; Ollila, Jyrki ; Putila, Veli-Pekka ; Keranen, Kimmo ; Hakkila, Jonna ; Kopola, Harri
Author_Institution
VTT Electron. & Infotech., Oulu, Finland
fYear
2000
fDate
2000
Firstpage
244
Lastpage
249
Abstract
When packaging multimode lasers into low-cost modules, passive fiber alignment would be extremely advantageous especially if the fiber alignment structures could be manufactured using the injection-molding technique. Injection molding as large-volume manufacturing technique allows for the reduction of the unit price of molded parts provided that the number of parts molded by using a single molding tool is large. In this paper, we compare active and passive fiber alignment techniques. The construction and packaging procedures of two modules packaged using active and passive alignment techniques are shown. Using a sleeve construction, a multimode laser with a 230 μm×2 μm emitting area was actively pigtailed with a 100/140-μm multimode fiber. In the other example, a multimode laser with a 300 μm×~1 μm emitting area was passively pigtailed with a 200/230-μm multimode fiber by the use of an alignment structure, which was precision-machined using LIGA technique. The study shows the applicability of the passive alignment technique for low-cost fiber pigtailing
Keywords
LIGA; integrated optics; modules; moulding; optical fibre couplers; semiconductor device packaging; semiconductor laser arrays; LIGA technique; active fiber alignment techniques; coupling efficiency; injection molding; laser array; laser packaging; low-cost fiber pigtailing; low-cost modules; multimode fiber; multimode laser pigtailing; passive fiber alignment techniques; precision-machining; sleeve construction; Costs; Fiber lasers; Injection molding; Integrated optics; Manufacturing; Optical devices; Optical fiber devices; Optical materials; Packaging machines; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853157
Filename
853157
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