• DocumentCode
    2167269
  • Title

    Enhancing power distribution system through 3D integrated models, optimized designs, and switching VRM model

  • Author

    Li, Y.L. ; Figueroa, David G. ; Chickamenahalli, Shamala A. ; Chung, Chee Yee ; Yew, Teong Guan ; Cornelius, Michael D. ; Do, Huong T.

  • Author_Institution
    Intel Corp., Chandler, AZ, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    272
  • Lastpage
    277
  • Abstract
    After conducting 3D integrated modeling of an Intel microprocessor, a distributed load current model represented the non-uniform power distribution on the chip is hooked up the on-chip interconnect. The on-chip interconnect is then tied to the integrated model. A multiple-phase, full synchronous switched dc/dc converter model is connected to the other end of the integrated model. Performance evaluation of the complete power delivery system based on a single and multiphase dc/dc converter is made. Advantages and disadvantages of each design are noted. Differences in the output characteristics with a simple source replacement of the dc source and with an actual voltage regulator module are highlighted
  • Keywords
    integrated circuit design; integrated circuit modelling; microprocessor chips; 3D integrated model; CPU package; Intel microprocessor; design optimization; distributed load current model; multiphase DC/DC converter; on-chip interconnect; power distribution system; switching voltage regulator module model; Capacitors; Clocks; Design optimization; Electromagnetic interference; Inductance; Integrated circuit interconnections; Microprocessors; Packaging; Power distribution; Power system modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-5908-9
  • Type

    conf

  • DOI
    10.1109/ECTC.2000.853162
  • Filename
    853162