Title :
Enhancing power distribution system through 3D integrated models, optimized designs, and switching VRM model
Author :
Li, Y.L. ; Figueroa, David G. ; Chickamenahalli, Shamala A. ; Chung, Chee Yee ; Yew, Teong Guan ; Cornelius, Michael D. ; Do, Huong T.
Author_Institution :
Intel Corp., Chandler, AZ, USA
Abstract :
After conducting 3D integrated modeling of an Intel microprocessor, a distributed load current model represented the non-uniform power distribution on the chip is hooked up the on-chip interconnect. The on-chip interconnect is then tied to the integrated model. A multiple-phase, full synchronous switched dc/dc converter model is connected to the other end of the integrated model. Performance evaluation of the complete power delivery system based on a single and multiphase dc/dc converter is made. Advantages and disadvantages of each design are noted. Differences in the output characteristics with a simple source replacement of the dc source and with an actual voltage regulator module are highlighted
Keywords :
integrated circuit design; integrated circuit modelling; microprocessor chips; 3D integrated model; CPU package; Intel microprocessor; design optimization; distributed load current model; multiphase DC/DC converter; on-chip interconnect; power distribution system; switching voltage regulator module model; Capacitors; Clocks; Design optimization; Electromagnetic interference; Inductance; Integrated circuit interconnections; Microprocessors; Packaging; Power distribution; Power system modeling;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853162