Title :
Adhesion characterization of no-flow underfills used in flip chip assemblies and correlation with reliability
Author :
Lu, Jicun ; Smith, Brian ; Baldwin, Daniel F.
Author_Institution :
George W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Adhesion is one of the key properties of underfills used in flip chip assemblies. This paper characterizes the adhesion strengths of no-flow underfill materials to various die passivations using the shear test techniques. A novel shear test vehicle with planar underfill layers between the die and substrate is presented. The adhesion strengths and failure modes of the no-flow underfill materials during shear testing correlate well with their thermal shock reliability test results. Underfill adhesion related failures such as delamination and crack are investigated and correlated between flip chip assemblies and shear test vehicle assemblies without solder joint interconnects
Keywords :
adhesion; encapsulation; flip-chip devices; integrated circuit reliability; adhesion; cracking; delamination; die passivation; failure mode; flip chip assembly; no-flow underfill material; shear testing; thermal shock reliability; Adhesives; Assembly; Delamination; Electric shock; Flip chip; Materials reliability; Materials testing; Passivation; Soldering; Vehicles;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853173
