Title :
Study on rate-dependent behaviors of underfills based on two-phase composites
Author :
Wang, Haiying ; Qian, Zhengfang ; Lu, Minfu ; Liu, Sheng ; Wu, Jiali ; Wong, C.P.
Author_Institution :
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
Abstract :
Underfills´ properties are very important for the reliability of flip chip packages. As epoxy based materials, underfills show obvious rate-dependent behaviors under mechanical loading. However, studies on the rate-dependent behavior of underfills have been rarely reported, In this paper, the rate-dependent strain-stress behavior of underfills is studied based on two-phase composite assumption. A micromechanical method is employed to predict the overall strain-stress behavior of underfills. Results show good agreement between the predicted data and experimental data
Keywords :
encapsulation; filled polymers; flip-chip devices; integrated circuit packaging; micromechanics; stress-strain relations; epoxy underfill material; flip-chip package; mechanical loading; micromechanical method; rate-dependent strain-stress characteristics; reliability; two-phase composite; Additives; Conducting materials; Elasticity; Electronic packaging thermal management; Epoxy resins; Materials science and technology; Micromechanical devices; Shape; Thermal conductivity; Viscosity;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853175
