Study on rate-dependent behaviors of underfills based on two-phase composites

Author

Wang, Haiying ; Qian, Zhengfang ; Lu, Minfu ; Liu, Sheng ; Wu, Jiali ; Wong, C.P.

Author_Institution

Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA

fYear

2000

fDate

2000

Firstpage

348

Lastpage

352

Abstract

Underfills´ properties are very important for the reliability of flip chip packages. As epoxy based materials, underfills show obvious rate-dependent behaviors under mechanical loading. However, studies on the rate-dependent behavior of underfills have been rarely reported, In this paper, the rate-dependent strain-stress behavior of underfills is studied based on two-phase composite assumption. A micromechanical method is employed to predict the overall strain-stress behavior of underfills. Results show good agreement between the predicted data and experimental data

Keywords

encapsulation; filled polymers; flip-chip devices; integrated circuit packaging; micromechanics; stress-strain relations; epoxy underfill material; flip-chip package; mechanical loading; micromechanical method; rate-dependent strain-stress characteristics; reliability; two-phase composite; Additives; Conducting materials; Elasticity; Electronic packaging thermal management; Epoxy resins; Materials science and technology; Micromechanical devices; Shape; Thermal conductivity; Viscosity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-5908-9

Type

conf

DOI

10.1109/ECTC.2000.853175

Filename

853175