Title :
The application of HITCE ceramic material for LGA-type chip scale package
Author :
Maeda, Kazutaka ; Higashi, Masahiko ; Kokubu, Masanari ; Nakagawa, Shoichi
Author_Institution :
R&D Center Kagoshima, Kyocera Corp., Kagoshima, Japan
Abstract :
Needs for the Chip Scale Package (CSP) is acceleratingly increased in the package market, where low cost, light weight, smaller, and thinner package is required. The increasing signal performance and number of functions of a signal processing system also require higher pin count and higher wiring density. To satisfy these needs, we have developed a high thermal coefficient of expansion (TCE) ceramic material, HITCE. This material enables a fine and flexible design of a package for high performance, and high reliability
Keywords :
ceramic packaging; chip scale packaging; thermal expansion; HITCE ceramic material; LGA chip scale package; land grid array; reliability; thermal coefficient of expansion; Capacitive sensors; Ceramics; Chip scale packaging; Costs; Joining processes; Lead; Signal processing; Soldering; Thermal stresses; Wiring;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853177
