DocumentCode :
2167667
Title :
Tapered windows in silicon dioxide layers for masking and passivation: obtaining and characterization methods
Author :
Negreanu, Mircea ; Gavrila, Raluca ; Dinescu, Adrian
Author_Institution :
Nat. Res. & Dev. Inst. for Microtechnol., Bucharest, Romania
Volume :
1
fYear :
1997
fDate :
7-11 Oct 1997
Firstpage :
243
Abstract :
Tapered windows in silicon dioxide layers were obtained by three different procedures, all involving the formation of a faster etching thin oxide layer on the top of the main masking layer. Slope angles for each case were estimated by several methods and the results compared and commented on
Keywords :
masks; passivation; photoresists; silicon compounds; sputter etching; SiO2; faster etching thin oxide layer; masking; masking layer; passivation; silicon dioxide layers; tapered windows; Etching; Goniometers; Hafnium; Human computer interaction; Interference; Measurement standards; Resists; Shape; Silicon compounds; Thickness control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 1997. CAS '97 Proceedings., 1997 International
Conference_Location :
Sinaia
Print_ISBN :
0-7803-3804-9
Type :
conf
DOI :
10.1109/SMICND.1997.651589
Filename :
651589
Link To Document :
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