Title :
Development of flex stackable carriers
Author :
Isaak, Harlan ; Uka, Pete
Author_Institution :
Dense-Pac Microsyst. Inc., Garden Grove, CA, USA
Abstract :
CSP´s and μBGA´s are becoming more common in the market place and present new challenges for stacking of devices. An investigation into possible methods of stacking these devices was undertaken. New materials such as z-axis epoxies and combination flux/underfill epoxies were considered as well as the possibilities of adhesiveless copper on flex for fine line etching. This paper describes the basic approach and the results of combining the new technologies into a versatile and novel stacking approach
Keywords :
ball grid arrays; chip scale packaging; μBGA; CSP; Cu; adhesiveless copper; fine line etching; flex stackable carrier; solder flux; underfill material; z-axis epoxy resin; Conducting materials; Copper; Electronics packaging; Flexible electronics; Flip chip; Integrated circuit interconnections; Space technology; Stacking; Temperature; Testing;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853181