DocumentCode
2167723
Title
Gate length scaling accelerated to 30 nm regime using ultra-thin film PD-SOI technology
Author
Fung, S.K.H. ; Khare, M. ; Schepis, D. ; Woo-Hyeong Lee ; Suk Hoon Ku ; Park, H. ; Snare, J. ; Doris, B. ; Ajmera, A. ; Muller, K.P. ; Agnello, P. ; Gilbert, P. ; Welser, J.
fYear
2001
fDate
2-5 Dec. 2001
Abstract
High performance SOI CMOS designed for the 100 nm technology node is presented. At 1 V supply voltage, the 33 nm devices give a drive current of 1000 (1100) /spl mu/A//spl mu/m DC (dynamic) for NFET and 445 (457) /spl mu/A//spl mu/m for PFET at an off current of 300 nA//spl mu/m. The intrinsic gate delays are 0.55 ps and 1.19 ps. The NFET delay is further reduced to 0.45 ps at gate length scaled to 25 nm. The delay and current values are the best ever reported at 1.0 V. The excellent result is accomplished by using super-HALO design on 45 nm SOI substrate.
Keywords
MOSFET; silicon-on-insulator; thin film transistors; 1.0 V; 100 nm; 25 nm; 33 nm; 45 nm; CMOS transistor; NFET; PFET; drive current; gate delay; gate length scaling; super-HALO design; ultra-thin-film PD-SOI technology; Acceleration; CMOS technology; Delay; Diodes; Doping profiles; Parasitic capacitance; Semiconductor films; Silicon; Substrates; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Conference_Location
Washington, DC, USA
Print_ISBN
0-7803-7050-3
Type
conf
DOI
10.1109/IEDM.2001.979587
Filename
979587
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