DocumentCode :
2167723
Title :
Gate length scaling accelerated to 30 nm regime using ultra-thin film PD-SOI technology
Author :
Fung, S.K.H. ; Khare, M. ; Schepis, D. ; Woo-Hyeong Lee ; Suk Hoon Ku ; Park, H. ; Snare, J. ; Doris, B. ; Ajmera, A. ; Muller, K.P. ; Agnello, P. ; Gilbert, P. ; Welser, J.
fYear :
2001
fDate :
2-5 Dec. 2001
Abstract :
High performance SOI CMOS designed for the 100 nm technology node is presented. At 1 V supply voltage, the 33 nm devices give a drive current of 1000 (1100) /spl mu/A//spl mu/m DC (dynamic) for NFET and 445 (457) /spl mu/A//spl mu/m for PFET at an off current of 300 nA//spl mu/m. The intrinsic gate delays are 0.55 ps and 1.19 ps. The NFET delay is further reduced to 0.45 ps at gate length scaled to 25 nm. The delay and current values are the best ever reported at 1.0 V. The excellent result is accomplished by using super-HALO design on 45 nm SOI substrate.
Keywords :
MOSFET; silicon-on-insulator; thin film transistors; 1.0 V; 100 nm; 25 nm; 33 nm; 45 nm; CMOS transistor; NFET; PFET; drive current; gate delay; gate length scaling; super-HALO design; ultra-thin-film PD-SOI technology; Acceleration; CMOS technology; Delay; Diodes; Doping profiles; Parasitic capacitance; Semiconductor films; Silicon; Substrates; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7050-3
Type :
conf
DOI :
10.1109/IEDM.2001.979587
Filename :
979587
Link To Document :
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