Title :
MCM technology for RF tunable band pass filters implemented by integration of GaAs FETs and selectively oxidized porous silicon (SOPS)
Author :
Lee, Jong-Soo ; Ha, Man-Lynn ; Kwon, Young-Se
Author_Institution :
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Taejon, South Korea
Abstract :
RF tunable band pass filter has been implemented using the MCM-Si technology on selectively oxidized porous silicon (SOPS) substrate. The key approach of this paper is to integrate the GaAs FETs with silicon substrate to minimize the unwanted area by passive components on GaAs. All components except the active devices are fabricated on the SOPS substrate using the conventional thin film process and integrated through the wire bonding technique. This RF tunable filter has shown the center frequency from 5.64 GHz to 5.74 GHz with 0 dB insertion loss. The implemented tunable band pass filter has the Q-factor control scheme through gate bias resistor according with the frequency change. The whole area of GaAs die where all active devices have been fabricated is as small as 0.8×0.9 mm2, which can be reduced to 0.6×0.7 mm2
Keywords :
III-V semiconductors; active filters; band-pass filters; elemental semiconductors; field effect transistors; gallium arsenide; multichip modules; porous semiconductors; radiofrequency filters; silicon; 5.64 to 5.74 GHz; GaAs; GaAs FET; MCM packaging technology; Q-factor; RF tunable band pass filter; Si; monolithic integration; selectively oxidized porous silicon substrate; thin film process; wire bonding; Band pass filters; Bonding; FETs; Gallium arsenide; Insertion loss; Radio frequency; Silicon; Substrates; Thin film devices; Wire;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853190