• DocumentCode
    2168086
  • Title

    Analyzing the effects of floating dummy-fills: from feature scale analysis to full-chip RC extraction

  • Author

    Keun-Ho Lee ; Jin-Kyu Park ; Young-Nam Yoon ; Dai-Hyun Jung ; Jai-Pil Shin ; Young-Kwan Park ; Jeong-Taek Kong

  • Author_Institution
    Semicond. R&D Center, Samsung Electron. Co. Ltd, Kyungki, South Korea
  • fYear
    2001
  • fDate
    2-5 Dec. 2001
  • Abstract
    Studies the effects of dummy-fills on the interconnect capacitance and the global planarity of chips in order to provide the design guideline of the dummy-fills. A simple but accurate full-chip RC extraction methodology taking the floating dummy-fills into account is proposed and applied to the analysis of changes in capacitance and signal delay of the global interconnects, for the first time. The results for 0.18 /spl mu/m designs clearly demonstrate the importance of considering floating dummy-fills in the interconnect modeling and the full-chip RC extraction.
  • Keywords
    capacitance; delays; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; 0.18 micron; design guideline; feature scale analysis; floating dummy-fills; full-chip RC extraction; global planarity; interconnect capacitance; interconnect modeling; signal delay; Capacitance; Computer aided engineering; Delay effects; Dielectrics; Guidelines; Planarization; Research and development; Signal analysis; Signal design; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7050-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2001.979600
  • Filename
    979600