Title :
Network analyzer calibration methods for high-density packaging characterization and validation of simulation models
Author :
Hammond, Cynthia L. ; Virga, Kathleen L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
A diversity of advanced modeling and simulation tools for application to packaging and interconnect problems have been developed over the past decade. The development of accurate mixed signal and high frequency models requires verification and validation using high frequency measurements. The need for model verification requires accurate measurement calibration for good comparison data. This work compares a variety of calibration methods for use with on-wafer probing and assesses their various advantages and limitations
Keywords :
calibration; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; network analysers; benchmark; conductor backed effects; high frequency model; high-density packaging; interconnect problems; line reflect match; mixed signal; network analyzer calibration; on-wafer probing; phasor; simulation models; Analytical models; Calibration; Coaxial components; Computational modeling; Computer simulation; Electronics packaging; Fabrication; Frequency measurement; Integrated circuit interconnections; Scattering parameters;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853207
