DocumentCode :
2168482
Title :
Silicon-On-Nothing (SON) applications for Low Power technologies
Author :
Monfray, S. ; Boeuf, F. ; Coronel, P. ; Bidal, G. ; Denorme, S. ; Skotnicki, T.
Author_Institution :
STMicroelectronics, Crolles
fYear :
2008
fDate :
2-4 June 2008
Firstpage :
1
Lastpage :
4
Abstract :
The power consumption and the matching will be the principal issues at the 32 nm node and below. In this context, Ultra-Thin Body devices are extensively studied for the end-of-roadmap CMOS. In this paper we present the SON technology, leading to the simple fabrication of sustained mono-Si nano-membranes over an empty tunnel, and discuss on the application of this process to build-up electronic devices. This technology opens a wide range of applications, in particular for the realization of localized single-gate fully depleted transistors on bulk substrates and of double-gate planar devices, co-integrable with conventional bulk devices.
Keywords :
CMOS integrated circuits; low-power electronics; SON technology; bulk substrates; double-gate planar devices; end-of-roadmap CMOS; localized single-gate fully depleted transistors; low power technologies; power consumption; silicon-on-nothing applications; sustained mono-Si nanomembranes; ultra-thin body devices; CMOS technology; Capacitance; Delay; Energy consumption; Fabrication; Germanium silicon alloys; High-K gate dielectrics; Nanoscale devices; Silicon germanium; Substrates; Low Power; SiGe; Silicon-On-Nothing; Ultra Thin Body Devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-1810-7
Electronic_ISBN :
978-1-4244-1811-4
Type :
conf
DOI :
10.1109/ICICDT.2008.4567232
Filename :
4567232
Link To Document :
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