• DocumentCode
    2168680
  • Title

    Charge trapping in Si implanted SIMOX

  • Author

    Bhar, T.N. ; Lambert, R.J. ; Hughes, H.L.

  • Author_Institution
    Univ. of the District of Columbia, Washington, DC, USA
  • fYear
    1997
  • fDate
    6-9 Oct 1997
  • Firstpage
    118
  • Lastpage
    119
  • Abstract
    The implantation and annealing processes of SIMOX fabrication may result in excess silicon atoms located in the buried oxide. These excess silicon atoms have been postulated by various researchers to be responsible for the formation of silicon clusters and associated defects in SIMOX. This work was performed to test this postulate. These defects result in a higher refractive index, an increase in the number of electron traps, and the production of traps with very large capture cross-sections. It is also known that excess silicon introduced by ion implantation creates electron traps in thermal oxides. This work supports the above postulate by implanting a large range of silicon concentrations into low defect multiple implant SIMOX and measuring the resulting electron traps by the avalanche injection technique
  • Keywords
    SIMOX; ULSI; electron traps; integrated circuit reliability; ion implantation; refractive index; segregation; Si:O; ULSI; avalanche injection technique; buried oxide; capture cross-sections; clusters; electron traps; ion implantation; multiple implant SIMOX; refractive index; thermal oxides; Annealing; Electron traps; Fabrication; Implants; Ion implantation; Performance evaluation; Production; Refractive index; Silicon; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 1997. Proceedings., 1997 IEEE International
  • Conference_Location
    Fish Camp, CA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-3938-X
  • Type

    conf

  • DOI
    10.1109/SOI.1997.634961
  • Filename
    634961