DocumentCode
2168680
Title
Charge trapping in Si implanted SIMOX
Author
Bhar, T.N. ; Lambert, R.J. ; Hughes, H.L.
Author_Institution
Univ. of the District of Columbia, Washington, DC, USA
fYear
1997
fDate
6-9 Oct 1997
Firstpage
118
Lastpage
119
Abstract
The implantation and annealing processes of SIMOX fabrication may result in excess silicon atoms located in the buried oxide. These excess silicon atoms have been postulated by various researchers to be responsible for the formation of silicon clusters and associated defects in SIMOX. This work was performed to test this postulate. These defects result in a higher refractive index, an increase in the number of electron traps, and the production of traps with very large capture cross-sections. It is also known that excess silicon introduced by ion implantation creates electron traps in thermal oxides. This work supports the above postulate by implanting a large range of silicon concentrations into low defect multiple implant SIMOX and measuring the resulting electron traps by the avalanche injection technique
Keywords
SIMOX; ULSI; electron traps; integrated circuit reliability; ion implantation; refractive index; segregation; Si:O; ULSI; avalanche injection technique; buried oxide; capture cross-sections; clusters; electron traps; ion implantation; multiple implant SIMOX; refractive index; thermal oxides; Annealing; Electron traps; Fabrication; Implants; Ion implantation; Performance evaluation; Production; Refractive index; Silicon; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 1997. Proceedings., 1997 IEEE International
Conference_Location
Fish Camp, CA
ISSN
1078-621X
Print_ISBN
0-7803-3938-X
Type
conf
DOI
10.1109/SOI.1997.634961
Filename
634961
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