DocumentCode :
2168827
Title :
Conduction development in electrically conductive adhesives with a bimodal size distributed conducting and inert particles: effect of polydispersity
Author :
Mikrajuddin ; Shi, F.G. ; Okuyama, K. ; Kim, H.K.
Author_Institution :
Fac. of Eng., Hiroshima Univ., Japan
fYear :
2000
fDate :
2000
Firstpage :
609
Lastpage :
614
Abstract :
A well known approach for reducing the electrical percolation threshold of an electrically conductive material is to mix the relatively small sized conducting fillers with the relatively large sized inert particles. The percolation limit in terms of the volume fraction of conducting particles is known to decrease with increasing ratio of the mean size between the small and large particles. However, both the small conducting and large inert particles rarely exist as monodispersed, rather, there is a respective size distribution for each of them. Such a size distribution is expected to affect the development of conductivity as well as the percolation threshold. The first theoretical model for considering such a size dispersity effect on the conduction development and the percolation limit is reported. It is shown that the present model not only includes all the previous ones for considering only the particle size ratio effect, it considers the respective role played by the ratio of mean particle size, the size dispersity and the volume fraction on the electrical conduction development and the percolation limit. The model suggests an innovative route for processing new conductive adhesives with ultralow percolation limits. Other implications for manufacturing electrically conductive adhesives are also discussed
Keywords :
adhesives; conducting polymers; electrical conductivity; filled polymers; particle size; percolation; adhesives manufacturing; bimodal size distributed particles; conducting fillers; conducting particles; conduction development; electrical conductivity model; electrical percolation threshold; electrically conductive adhesives; inert particles; lead-free solder alternative; mean particle size; particle size ratio effect; polydispersity effect; size dispersity effect; ultralow percolation limit; volume fraction of particles; Biological materials; Chemical engineering; Chemical processes; Conducting materials; Conductive adhesives; Conductivity; Environmentally friendly manufacturing techniques; Laboratories; Lead; Materials science and technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
Type :
conf
DOI :
10.1109/ECTC.2000.853221
Filename :
853221
Link To Document :
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