Title :
An SOI-based self-aligned quasi-SOI MOSFET with π-shaped semiconductor conductive layer
Author :
Eng, Yi-Chuen ; Lin, Jyi-Tsong ; Kang, Shiang-Shi
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung
Abstract :
A non-classical device structure namely self-aligned quasi-silicon-on-insulator (SOI) metal-oxide semiconductor (MOS) field-effect transistor with pi-shaped semiconductor conductive layer (SA-piFET) is presented, seeking to improve the performance and upgrade the reliability of the SOI-based devices. Designed to equip with a SA single crystal silicon channel layer, plus a natural source/drain (S/D) tie and a block oxide island (BOI) under the channel, the SA-piFET, by minimizing the self-heating and charge sharing issues, thus manages to obtain better stability and reliability. Based on two-dimensional (2-D) simulations, the S/D tie serves to reduce the lattice-atom thermal vibrations and the BOI under the channel is used to control the short-channel effects (SCEs). Also, although the electrical characteristics of the SA-piFET are somewhat worse than the SA recessed S/D (ReS/D) ultra-thin (UT) SOI, it works without self-heating increasing.
Keywords :
MOSFET; semiconductor device reliability; silicon-on-insulator; Si; block oxide island; channel layer; lattice-atom thermal vibrations; metal-oxide semiconductor field-effect transistor; pi-shaped semiconductor conductive layer; quasiSOI MOSFET; quasisilicon-on-insulator; self-aligned MOSFET; semiconductor device reliability; short-channel effects; single crystal silicon; source/drain tie; Electric variables; FETs; Insulation; MOS devices; MOSFET circuits; Semiconductor device reliability; Semiconductor films; Silicon on insulator technology; Thermal resistance; Thermal stability; block oxide island (BOI) under the channel; charge sharing; self-aligned quasi-SOI MOSFET with π-shaped semiconductor conductive layer (SA-πFET); self-heating; short-channel effects (SCEs); source/drain (S/D) tie;
Conference_Titel :
Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-1810-7
Electronic_ISBN :
978-1-4244-1811-4
DOI :
10.1109/ICICDT.2008.4567250