DocumentCode :
2168928
Title :
0.1 /spl mu/m-rule MRAM development using double-layered hard mask
Author :
Tsuji, K. ; Suemitsu, K. ; Mukai, T. ; Nagahara, K. ; Masubuchi, H. ; Utsumi, H. ; Kikuta, K.
Author_Institution :
Silicon Syst. Labs., NEC Corp., Kanagawa, Japan
fYear :
2001
fDate :
2-5 Dec. 2001
Abstract :
0.1 /spl mu/m rule magnetic random access memory (MRAM) was developed using double-layered hard mask of SiO/sub 2//metal. 30% magnetoresistance ratio under switching operation, read and write characteristics for MRAM cell with 0.1/spl times/0.6 /spl mu/m/sup 2/ were observed using current induced magnetic field. It is found that switching current of tunneling magnetoresistance (TMR) device with 0.1 /spl mu/m length can be reduced by thinning free layer and reduction of TMR aspect ratio.
Keywords :
magnetic storage; magnetic switching; magnetoresistive devices; masks; random-access storage; tunnelling; 0.1 micron; SiO/sub 2/; SiO/sub 2//metal double-layered hard mask; aspect ratio; current induced magnetic field; free layer thinning; magnetic random access memory; magnetoresistance ratio; read characteristics; switching current; tunneling magnetoresistance device; write characteristics; Lithography; Magnetic devices; Magnetic fields; Magnetic films; Magnetic switching; Nonvolatile memory; Oxidation; Random access memory; Tin; Tunneling magnetoresistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-7050-3
Type :
conf
DOI :
10.1109/IEDM.2001.979635
Filename :
979635
Link To Document :
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