• DocumentCode
    2168979
  • Title

    SOI chip design and charging damage

  • Author

    Hook, Terence B.

  • Author_Institution
    IBM Microelectron., Essex Junction, VT
  • fYear
    2008
  • fDate
    2-4 June 2008
  • Firstpage
    83
  • Lastpage
    86
  • Abstract
    In this paper we discuss some aspects of antennas in real designs in SOI technology, and show how the concepts manifest themselves in actual chips, where second-order effects such as resistance and the details of the processing sequence can play an important role. We also discuss the ramifications of a more recent technique which inserts bulk contacts into the SOI design, thereby imposing a bulk-like character to the antenna rules, while maintaining the performance advantages of SOI.
  • Keywords
    antennas; silicon-on-insulator; SOI chip design; SOI technology; bulk devices; bulk technology; charging damage; circuit design; insulating oxide layer; wafer bulk; Antennas and propagation; Chip scale packaging; Circuit simulation; Circuit synthesis; Electrons; Insulation; Integrated circuit interconnections; Isolation technology; Microelectronics; Paper technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-1810-7
  • Electronic_ISBN
    978-1-4244-1811-4
  • Type

    conf

  • DOI
    10.1109/ICICDT.2008.4567252
  • Filename
    4567252