DocumentCode
2168979
Title
SOI chip design and charging damage
Author
Hook, Terence B.
Author_Institution
IBM Microelectron., Essex Junction, VT
fYear
2008
fDate
2-4 June 2008
Firstpage
83
Lastpage
86
Abstract
In this paper we discuss some aspects of antennas in real designs in SOI technology, and show how the concepts manifest themselves in actual chips, where second-order effects such as resistance and the details of the processing sequence can play an important role. We also discuss the ramifications of a more recent technique which inserts bulk contacts into the SOI design, thereby imposing a bulk-like character to the antenna rules, while maintaining the performance advantages of SOI.
Keywords
antennas; silicon-on-insulator; SOI chip design; SOI technology; bulk devices; bulk technology; charging damage; circuit design; insulating oxide layer; wafer bulk; Antennas and propagation; Chip scale packaging; Circuit simulation; Circuit synthesis; Electrons; Insulation; Integrated circuit interconnections; Isolation technology; Microelectronics; Paper technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-1810-7
Electronic_ISBN
978-1-4244-1811-4
Type
conf
DOI
10.1109/ICICDT.2008.4567252
Filename
4567252
Link To Document