DocumentCode :
2169008
Title :
Influence of backside metallization on a coplanar X-band LNA
Author :
Follmann, R. ; Langgartner, G. ; Borkes, J. ; Wolff, I. ; Feldle, H.P.
Author_Institution :
IMST GmbH, D-47475 Kamp-Lintfort, Germany. e-mail: follmann@imst.de
fYear :
2002
fDate :
23-26 Sept. 2002
Firstpage :
1
Lastpage :
4
Abstract :
In this paper the influence of the backside metallization on a coplanar X-band low noise amplifier MMIC is described. First, we demonstrate the selection of transistor devices including the modelling especially with respect to the extraction of RF noise parameters. After that the simulation results and the layout of the LNA are presented, neglecting backside effects on coplanar circuits. Completing measurements on the fabricated LNA show the influence of the backside metallization in comparison with simulation results.
Keywords :
Circuit noise; Circuit simulation; Equivalent circuits; Integrated circuit noise; Low-noise amplifiers; Metallization; Noise figure; Radio frequency; Roentgenium; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2002. 32nd European
Conference_Location :
Milan, Italy
Type :
conf
DOI :
10.1109/EUMA.2002.339226
Filename :
4140306
Link To Document :
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