• DocumentCode
    2169095
  • Title

    Metal gate effects on a 32 nm metal gate resistor

  • Author

    Dao, Thuy ; Lim, Ik Sung ; Connell, Larry ; Triyoso, Dina H. ; Park, Youngbog ; Mackenzie, Charlie

  • Author_Institution
    Freescale Semicond., Austin, TX
  • fYear
    2008
  • fDate
    2-4 June 2008
  • Firstpage
    109
  • Lastpage
    112
  • Abstract
    CMOS technology scaling has allowed for unprecedented integration of analog and digital circuits onto a single chip. The integration of RF and analog circuits with digital logic has provided the consumer with wireless devices with high performance and increasing functionality but at lower cost. System-on-chip (SOC) is considered the ultimate goal for a low cost, high performance semiconductor chip for mobile products. At the 32 nm node, high-K and metal gate will be the mainstream gate stack in high volume manufacturing. In this paper, we will review SOC requirements with a focus on high-K / metal gate effects on analog passive devices. We will present a new metal gate resistor which can be programmed to exhibit either a positive , negative, or zero temperature coefficient (TC) by adjusting its physical dimensions. We will also discuss the trade-offs that RF / analog designers will have to take into consideration.
  • Keywords
    CMOS integrated circuits; mixed analogue-digital integrated circuits; resistors; system-on-chip; CMOS technology scaling; RF circuits; SOC; analog circuits; analog passive devices; digital circuits; digital logic; high performance semiconductor chip; mainstream gate stack; metal gate effects; metal gate resistor; size 32 nm; system-on-chip; zero temperature coefficient; Analog circuits; CMOS analog integrated circuits; CMOS digital integrated circuits; CMOS logic circuits; CMOS technology; Digital circuits; High K dielectric materials; High-K gate dielectrics; Radio frequency; Resistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-1810-7
  • Electronic_ISBN
    978-1-4244-1811-4
  • Type

    conf

  • DOI
    10.1109/ICICDT.2008.4567257
  • Filename
    4567257