MEMS modular packaging and interfaces

Author

Schuenemann, Matthias ; Jam, Kourosh Amiri ; Grosser, Volker ; Leutenbauer, Rudolf ; Bauer, Gerd ; Schaefer, Wolfgang ; Reichl, Herbert

Author_Institution

Fraunhofer Inst. Manuf. Eng. & Autom. IPA, Stuttgart, Germany

fYear

2000

fDate

2000

Firstpage

681

Lastpage

688

Abstract

Many industrial branches other than automotive industry may benefit from MEMS technology. Most of them require custom-designed MEMS in mid-scale volumes, which are at present not available at acceptable costs. A modular MEMS packaging and interface concept may contribute to less costly solutions with faster time to market. A 3D stackable packaging concept, the Top-Bottom Ball Grid Array TB-BGA, which includes electric, fluidic, optic, and communication interfaces, is proposed. Several realization technologies (LTCC, 3D-BGA, StackPack) as well as first applications are discussed

Keywords

ball grid arrays; integrated circuit packaging; micromechanical devices; modules; 3D stackable packaging; 3D-BGA; LTCC; MEMS modular packaging; StackPack; TB-BGA; Top-Bottom Ball Grid Array; automotive industry; custom-designed MEMS; modular MEMS packaging; Automotive engineering; Costs; Electronics packaging; Fabrication; Intelligent sensors; Manufacturing automation; Manufacturing industries; Micromechanical devices; Nanoelectromechanical systems; Production;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-5908-9

Type

conf

DOI

10.1109/ECTC.2000.853232

Filename

853232