MEMS sensor multi-chip module assembly with TAB carrier pressure belt for aircraft flight testing

Many different sensor types and their associated electronic systems are utilized for aircraft and aerospace applications. When atmospheric data is collected like pressure load surveys for aircraft, arrays of many sensors are required on a common bus. With the support from a device manufacturer, we have been developing a multi-Micro-Electro-Mechanical System (MEMS) sensor based electronic system. We report in this paper a unique electronic packaging configuration incorporating MEMS sensors, multi-chip modules (MCMs) and tape automated bonding (TAB) carrier. Electronic assembly and interconnection methods used for various levels of packaging are also described. They include direct-chip-attachment (flip chip) process for the MEMS device to the module and bus connection through TAB carrier to the host computer. Encapsulation material for electronic components was selected for improving the reliability of the module. Localized circuit functionality was needed to conduct temperature compensation and self-calibration. A thin and/or miniaturized profile was required for aerodynamic reasons. Fully assembled hardware in the form of a pressure belt was installed on airplanes and passed two separate flight tests. Data analyses on these flight test results are also included