Title :
Solder bars-a novel flip chip application for high power devices
Author :
Elenius, Peter ; Yang, Hong ; Benson, Roger
Author_Institution :
Flip Chip Technol., Phoenix, AZ, USA
Abstract :
The compatibility of conventional flip chip technology for high power/high current applications can present functional and reliability issues during the device operating life. Typical flip chip solder bumps can experience early failures due to electromigration when exposed to a high current density at a given junction temperature. As a viable alternative, the solder bar approach was developed to increase the cross-sectional area of the solder joint, there by reducing current density and improving device operating life
Keywords :
flip-chip devices; soldering; current density; electromigration; failure analysis; flip-chip technology; high current packaging; high power device; operating lifetime; reliability; solder bar; Assembly; Bars; Copper; Current density; Electromigration; Electrons; Flip chip; Temperature; Thermal conductivity; Tin;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853234
