DocumentCode
2169316
Title
A simple condition for maximum bandwidth of a chip packaged in an mm-wave waveguide
Author
Jastrzebski, Adam K.
Author_Institution
Department of Electronics, University of Kent, Canterbury, Kent, CT2 7NT, UK. Phone +44 1227 823704; Fax +44 1227 456084; E-mail A.K.Jastrzebski@ukc.ac.uk
fYear
2002
fDate
23-26 Sept. 2002
Firstpage
1
Lastpage
4
Abstract
Waveguides can be used as both packaging cases and interconnection media between chips. No bond wires are needed in this packaging technique and, consequently, it can be used in millimetre wave circuits and systems. However, a chip inserted in a waveguide introduces additional unwanted propagation modes and reduces an effective bandwidth of the structure. A simple condition for an optimum placement of the chip to maximise the bandwidth is derived and confirmed by a rigorous 3-D electromagnetic simulation of WR6 and WR10 waveguide packages for typical GaAs and InP chip dimensions.
Keywords
Bandwidth; Bonding; Circuit simulation; Circuits and systems; Electromagnetic propagation; Electromagnetic scattering; Electromagnetic waveguides; Integrated circuit interconnections; Packaging; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2002. 32nd European
Conference_Location
Milan, Italy
Type
conf
DOI
10.1109/EUMA.2002.339238
Filename
4140318
Link To Document