Title :
A simple condition for maximum bandwidth of a chip packaged in an mm-wave waveguide
Author :
Jastrzebski, Adam K.
Author_Institution :
Department of Electronics, University of Kent, Canterbury, Kent, CT2 7NT, UK. Phone +44 1227 823704; Fax +44 1227 456084; E-mail A.K.Jastrzebski@ukc.ac.uk
Abstract :
Waveguides can be used as both packaging cases and interconnection media between chips. No bond wires are needed in this packaging technique and, consequently, it can be used in millimetre wave circuits and systems. However, a chip inserted in a waveguide introduces additional unwanted propagation modes and reduces an effective bandwidth of the structure. A simple condition for an optimum placement of the chip to maximise the bandwidth is derived and confirmed by a rigorous 3-D electromagnetic simulation of WR6 and WR10 waveguide packages for typical GaAs and InP chip dimensions.
Keywords :
Bandwidth; Bonding; Circuit simulation; Circuits and systems; Electromagnetic propagation; Electromagnetic scattering; Electromagnetic waveguides; Integrated circuit interconnections; Packaging; Wires;
Conference_Titel :
Microwave Conference, 2002. 32nd European
Conference_Location :
Milan, Italy
DOI :
10.1109/EUMA.2002.339238
