DocumentCode :
2169326
Title :
An In-Depth Investigation of Physical Mechanisms Governing SANOS Memories Characteristics
Author :
Bocquet, M. ; Vianello, E. ; Molas, G. ; Perniola, L. ; Grampeix, H. ; Martin, F. ; Colonna, J.P. ; Papon, A.M. ; Brianceau, P. ; Gély, M. ; De Salvo, B. ; Pananakakis, G. ; Ghibaudo, G. ; Selmi, L.
Author_Institution :
CEA, MINATEC, Grenoble
fYear :
2009
fDate :
10-14 May 2009
Firstpage :
1
Lastpage :
4
Abstract :
The goal of this work is to give a clear physical comprehension of the charge loss mechanisms of SANOS (Si/Al2O3/Si3N4/SiO2/Si) memories. Retention at room and high temperature is investigated on different samples through experiments and theoretical modeling. We argue that at room temperature, the charge loss essentially results from the tunneling of the electrons trapped at the nitride interface, and the retention life time increases with the nitride thickness. On the contrary, at high temperature, the trapped charges in the nitride volume quickly redistribute, thanks to the thermal emission process, and they migrate to the nitride interface. Indeed, this result suggests that thin-nitride thicknesses in SANOS devices allow keeping a fast program/erase speed without degrading the retention at high temperature.
Keywords :
aluminium compounds; elemental semiconductors; integrated memory circuits; silicon; silicon compounds; transistors; tunnelling; SANOS memories; Si-Al2O3-Si3N4-SiO2-Si; charge loss; charge trapping; electron trapping; high temperature retention; nitride interface; retention lifetime; room temperature retention; temperature 293 K to 298 K; thermal emission; tunneling; Aluminum oxide; Atomic layer deposition; Electron traps; Nonvolatile memory; Stress; Temperature; Thermal degradation; Tunneling; Water;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Memory Workshop, 2009. IMW '09. IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
978-1-4244-3762-7
Type :
conf
DOI :
10.1109/IMW.2009.5090579
Filename :
5090579
Link To Document :
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